Meiwafosis is Exhibiting at IMC21!

Breaking through the limits of conventional SEM imaging - the Tennant20 Osmium Coating System, engineered in Japan.

Eliminating the granular noise associated with gold coating, it enables clear, artifact-free imaging without charging, revealing the true morphology of nanostructures.

Accel. Voltage 1,0kV Magnification 30,000× Os Thickness 5nm

Data: SHIRAISHI CENTRAL LABORATORIES CO., LTD.

Osmium coating applies plasma CVD technology, refined through decades of use in the semiconductor industry, to deposit metallic osmium films with nanometer-scale thickness control. The process forms a highly uniform conductive film at low temperatures with exceptional thickness reproducibility.

By minimizing charging during SEM imaging and elemental analysis, it enables high-resolution observation of fine surface structures with remarkable clarity.

Metallic osmium deposition occurs only within the negative glow region. With conventional parallel-plate electrodes, this region extends only 5mm above the center of the sample stage.

The Tennant20 features a specially engineered electrode design that expands the negative glow region to 20mm in height. This enables stable, uniform osmium film deposition even on samples with significant height variations.

Sputter coating often leads to charging because conductive coverage can be insufficient on complex surfaces.

In contrast, osmium coating provides excellent conductivity, minimizing charging and enabling clear imaging even within complex geometries.

Our osmium coating systems provide excellent coating coverage, even on overlapping samples, effectively preventing charging and enabling high-contrast observation of the entire sample. On the other hand, gold sputtering often results in charging, particularly in overlapping areas due to poor coating. This limits the maximum magnification to around 2000x. However, osmium coating allows for high-resolution imaging even at 5000x, revealing fine details.

Data provided by Toyohashi University of Technology, Electronic Materials Course, Hiroyuki Muto

Under gold sputter coating, much of the visible texture can originate from the coating itself rather than the sample.

Osmium coating produces virtually no grain-related artifacts. Even at 150,000× magnification, it reveals the sample surface as it truly is.

Polymer films

At 100,000x, osmium coating provides a smooth surface without any granular artifacts, allowing for clear observation of the true surface structure. In contrast, platinum coating results in a granular surface, obscuring the underlying structure. Osmium coating enables high-resolution imaging without the granular artifacts commonly associated with platinum coating. Additionally, the low applied voltage prevents heat damage to organic samples.

Data provided by Industrial Technology Research Institute (Taiwan)

Sputter coating can introduce thermal damage during the coating process.

With a deposition time of only 20 seconds, osmium coating minimizes thermal exposure, preserving the original sample morphology and enabling observation of the sample in its original state.

Comparative imaging of rat heart vascular casts

Gold sputtering requires approximately 3 minutes of coating to minimize charging, and this prolonged process often results in heat damage, causing shrinkage and a thick, uneven coating that can obscure fine surface details. In contrast, osmium coating produces a thin, uniform film in just 20 seconds, eliminating charging artifacts and enabling high-resolution imaging of the sample's true morphology. At 6,000x, the difference in surface morphology between the two coating methods is evident.

Data provided by Okayama University, Graduate School of Medicine, Dentistry and Pharmaceutical Sciences, Department of Human Morphology

The Tennant20 was designed to overcome the inherent limitations of conventional osmium coaters.

Three core technologies maximize reproducibility and precision.

By insulating the perimeter of the electrode with Teflon, the negative glow region—where the Os film forms—is expanded to 20mm above the sample stage (compared to just 5mm in conventional models). This expanded region enables uniform coating across a larger number of samples in a single run.

Consistent results, regardless of who operates the system. High-speed feedback control corrects current fluctuations every millisecond, while timer control with 0,01-second resolution enables precise control of ultra-thin films from 0,5nm upward. By minimizing process variability, the Tennant20 delivers stable and reproducible coating results.

Engineered for complete gas control. A fully sealed system and automated exhaust sequence effectively manage residual gas within the chamber. After coating is complete, the chamber atmosphere is automatically purged and replaced with clean air. Dedicated solenoid valves automatically close during power interruptions, helping prevent accidental gas leakage.